Semiconductor Packageのメーカーや取扱い企業、製品情報、参考価格、ランキングをまとめています。
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Semiconductor Package - メーカー・企業5社の製品一覧とランキング

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Semiconductor Packageのメーカー・企業ランキング

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  1. Wave Technology Hyogo//Service Industry
  2. 日本ミクロン Nagano//Electronic Components and Semiconductors
  3. アルス株式会社 本社工場、第2～第5工場 Fukushima//Electronic Components and Semiconductors
  4. 4 GLORY 東京営業所 Tokyo//Electronic Components and Semiconductors
  5. 5 ソニーグローバルマニュファクチャリング&オペレーションズ Tokyo//Other manufacturing
企業ランキングへ

Semiconductor Packageの製品ランキング

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  1. Semiconductor package (EBGA) 日本ミクロン
  2. [Data] WTI Blog April 2018 - March 2019 Wave Technology
  3. Semiconductor Package GLORY 東京営業所
  4. [Data] WTI Blog November 2020 Wave Technology
  5. 4 [Data] WTI Blog June 2021 Wave Technology

Semiconductor Packageの製品一覧

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[Information] WTI Blog: Semiconductor Packaging Edition

[Information] WTI Blog: Semiconductor Packaging Edition

Packed with our company's know-how on the occurrence and measurement methods of "warping" in semiconductor packages!

This document summarizes the WTI blog of Wave Technology Co., Ltd., which is engaged in the "Development Design Promotion Business" aimed at solving the shortage of engineers, covering the years 2017 to 2020, specifically focusing on semiconductor packaging. It includes topics such as "What is packaging?", an "Introduction to semiconductor packaging," and "Electrical characteristic models for noise analysis." Please take a moment to read it. 【Contents (Excerpt)】 ■2017.6.6 What is packaging? ■2017.6.13 There are many types of packaging! ■2017.9.26 Introduction to semiconductor packaging Part 3: 'High-functionality packages' ■2017.12.26 Introduction to semiconductor packaging Part 4: 'Wire BGA packages' ■2018.4.3 Introduction to semiconductor packaging Part 5: 'Lead frame packages' *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductors
  • Evaluation Board

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Semiconductor Package

Semiconductor Package

Production of semiconductor packages based on materials science.

We have over 15 years of experienced professional engineers in development and production, meeting customer needs. We develop standard butterfly packages for optical communication and supply high-quality optoelectronic components, such as BTF-PKG, mini-DIL-PKG, and subcomponents that meet MIL standard 883E, at low costs.

  • Other semiconductors

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Semiconductor package (EBGA)

Semiconductor package (EBGA)

A semiconductor package that supports miniaturization and high density through unique cavity structure formation technology.

Our "Semiconductor Package (EBGA)" responds to miniaturization and high density through the adoption of unique cavity structure formation technology, fine pattern formation technology, and electroless gold plating technology. Using our proprietary method, we manufacture packages with a three-dimensional cavity structure. It is also possible to directly replace the cavity structure of a ceramic substrate with a glass-epoxy substrate. Furthermore, by implementing functional components in the cavity section, internal component embedding is possible. This allows for shorter signal propagation distances, making it effective for high-speed processing. 【Features】 ■ Unique cavity formation technology ■ Supports miniaturization and high density ■ Effective for high-speed processing ■ Can use the substrate surface as the mounting surface in combination with build-up ■ Produces high-speed processing packages by bonding metal heat spreaders *For more details, please refer to the catalog or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing
  • Other semiconductors

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3D implementation contributes to miniaturization and high density.

3D implementation contributes to miniaturization and high density.

We contribute to miniaturization of products through 3D implementation technologies such as PoP (Package on Package) implementation.

PoP technology is adopted in products that require miniaturization and high density, such as smartphones and digital still cameras, and our company has achieved a cumulative production record of over 100 million units to date. Additionally, we possess technologies for stacking substrates beyond PoP, enabling us to respond to product miniaturization. 【Features】 ■ By stacking two semiconductor packages, it is possible to reduce the footprint on the substrate. ■ By using wiring between the upper and lower packages, we can shorten the wiring length compared to wiring on the substrate, enabling high-speed wiring. ■ By using tested packages with guaranteed quality, we can reduce the failure rate compared to SiP. ■ We can also accommodate substrate stacking beyond PoP. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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[Data] WTI Blog November 2020

[Data] WTI Blog November 2020

Evaluation and analysis methods for BGA packages and BGA substrate design are published!

This document summarizes the WTI blog of Wave Technology Co., Ltd., which is engaged in the "Development Design Promotion Business" aimed at solving the shortage of engineers, from November 2, 2020, to November 27, 2020. It introduces topics such as "Recommendation for Automatic Measurement - Basics of Instrument Control" from November 2, 2020, "Evaluation and Analysis Methods for BGA Packages" from November 10, 2020, and "What is the Required Ground Area for Each LTE Band?" from November 11, 2020. Additionally, it includes a wealth of useful information related to products and industries. We encourage you to take a look. [Contents] ■ November 2, 2020: Recommendation for Automatic Measurement - Basics of Instrument Control ■ November 5, 2020: Required Functions for Power Conditioners (Part 1) ■ November 6, 2020: Trying Illumination Control with Arduino Part 1 ■ November 10, 2020: Evaluation and Analysis Methods for BGA Packages ■ November 11, 2020: What is the Required Ground Area for Each LTE Band? (Radiation Efficiency of Monopole Antennas) *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Embedded system design service
  • Circuit board design and manufacturing

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[Data] WTI Blog January 2022

[Data] WTI Blog January 2022

Introduction of necessary items for semiconductor package assembly and examples of inquiries from substrate manufacturers.

This document summarizes the WTI blog of Wave Technology Co., Ltd., which is engaged in the "Development Design Promotion Business" to solve the shortage of engineers, from January 11, 2022, to January 25, 2022. It introduces topics such as "What is needed for assembling semiconductor packages" from January 11, 2022, "Inquiry case studies from substrate manufacturers" from January 18, 2022, and "The birth of WTI's navigation character 'Namirin's' Air POP balloon!" from January 25, 2021. In addition, we have published a wealth of useful information related to products and industries. We encourage you to read it. [Contents] ■ January 11, 2022 "What is needed for assembling semiconductor packages" ~ Printed Circuit Board Design Edition ~ ■ January 18, 2022 Inquiry case studies from substrate manufacturers ~ Substrate design also requires adjustments that align with the manufacturing processes of substrate manufacturers ~ ■ January 25, 2021 The birth of WTI's navigation character "Namirin's" Air POP balloon! *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductors
  • Printed Circuit Board
  • Other electronic parts

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Ultra Low Profile Package

Ultra Low Profile Package

New structure ultra-low profile package! Development and provision planned using proprietary technology.

The "Ultra Low Profile Package" is a product that achieves ultra low profile and low resistance wiring through a structure that does not use conventional Cu frames or interposers such as PCBs. We plan to develop and provide the ultra low profile package with a new package structure using our unique technology. 【Features】 ■ Development and provision of ultra low profile packages using unique technology ■ Structure that does not use conventional Cu frames or interposers such as PCBs ■ Ultra low profile and low resistance wiring package ■ Dimple processing at the terminal area *For more details, please refer to the PDF materials or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing
  • Contract manufacturing

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Cu frame type "Package with Beer Hall"

Cu frame type "Package with Beer Hall"

Package using patented technology! Formation of solder fillet through special processing.

The Cu frame type "Package with Via Holes" is a package that enables the reliable formation of solder fillets due to special processing at the terminal parts. It utilizes patented technology to achieve high soldering quality and improve the appearance inspection after mounting. In standard non-leaded packages, the exposed parts of the lead frame terminals are prone to oxidation, which reduces solder wettability. However, by forming via holes, solder can spread from the plated areas of the via holes, making it suitable for automotive packages with reliable solder joints and visibility for inspection. 【Features】 ■ Reliable formation of solder fillets ■ Achievement of high soldering quality and improved appearance inspection after mounting ■ Package using patented technology ■ Reliable solder joints and visibility for inspection *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing
  • Contract manufacturing

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[Data] WTI Blog April 2018 - March 2019

[Data] WTI Blog April 2018 - March 2019

Important considerations when designing semiconductor packages and antennas are included!

This document summarizes the WTI blog of Wave Technology Co., Ltd., which is engaged in the "Development Design Promotion Business" aimed at solving the shortage of engineers, from April 3, 2018, to March 29, 2019. It introduces the fifth installment of semiconductor package introductions on April 3, 2018, titled "Lead Frame Package," as well as embedded security measures that developers in the IoT era should be aware of from May 8, 2018, and considerations when designing antennas from June 5, 2018. In addition, it includes a wealth of useful information related to products and industries. We encourage you to read it. [Contents (excerpt)] ■ April 3, 2018 - April 24, 2018 ■ May 8, 2018 - May 29, 2018 ■ June 5, 2018 - June 26, 2018 ■ July 3, 2018 - July 31, 2018 ■ August 7, 2018 - August 28, 2018 *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Embedded system design service
  • Circuit board design and manufacturing

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[Data] WTI Blog June 2021

[Data] WTI Blog June 2021

Publication on alternative product research for EOL measures and introduction to semiconductor package assembly processes!

This document summarizes the WTI blog of Wave Technology Co., Ltd., which is engaged in "development and design promotion business" to solve the shortage of engineers, from June 1, 2021, to June 29, 2021. It introduces topics such as "Investigation of Alternatives in EOL Measures" on June 8, 2021, "Continued Design Considering PCB Manufacturing" on June 14, 2021, and "The Ventilation Policy for Electronic Devices is the Same as for Rooms" on June 23, 2021. In addition, we have published a wealth of useful information regarding products and industries. We encourage you to read it. [Contents (excerpt)] ■ June 1, 2021: What is ESD Testing? ■ June 8, 2021: Investigation of Alternatives in EOL Measures - Using Crystal Oscillators as an Example ■ June 14, 2021: Continued Design Considering PCB Manufacturing ■ June 15, 2021: WTI Supports Sustainable Development ■ June 22, 2021: Functions Required for Power Conditioners (Part 2) *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Embedded system design service
  • Circuit board design and manufacturing

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